Each batch is 100% verified by ICT testing
Each production batch is 100% verified for the quality of the soldering to the positioning of the components, and mounting errors can be monitored and validated with the aid of the AOI automatic optical inspection machine or by visual inspection.
Upon completion of the product, further verification is carried out prior to shipment.
Testing the product helps us to analyse our production process and refine it if problems arise or to intervene and examine any defects on components and PCBs.
Upon request, the programming and the inspection and analysis of any defects are handled by an internal traceability system to provide a report on the batch produced.
We can inspect/test the boards according to the documentation provided by the customer on inspections and related specific software and equipment.
Screen printing via optical centring with automatic screen printing control
This machine is placed upstream of the SMT production process and the advanced optical centring system ensures precise alignment of the PCB.
Printed circuit baking
At times the “delicacy” of the printed circuit is underestimated, they are produced with a composite material called vetronite (FR-4) formed from a fabric of glass fibre woven into a flame-retardant epoxy resin.
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AOI Automatic Optical Inspection
Automatic optical inspection is a very important verification system that ensures the maximum reliability of the boards after assembly.
The operating principle of AOI is based on the acquisition of images through a very high-definition camera and a lighting system that emits flashes in sequence with different wavelengths capable of reaching all points of the electronic board being inspected.
The images captured are then compared with those in the library or, in the case of sequential AOI, with those previously captured. If this process highlights possible defects on the board, an operator will analyse and if necessary resolve the fault, reporting the problem to the assembly or design department so that it can intervene to avoid the problem in future.
Automatic Optical Inspection is used during the SMT and PTH assembly process and is performed on 100% of the production to check the absence of any assembly or soldering defects. AOI ensures a considerable benefit in economic terms, as it allows us to identify possible defects in advance before they affect the functionality of the assembled board.
X-ray Inspection
This machine allows the inspection and analysis of components such as BGA and QFN where soldering is not visible with traditional systems; it can highlight any short circuits, voids and soldering that is not completely correct.
Thanks to top-quality high magnification, it also allows us to analyse the interior of the components and identify any defects and/or breakages within the devices.
Given the increasing miniaturisation and complexity of components, this type of technology is now essential for the creation of the electronic board
Tests following customer specifications, bed-of-nails inspections and programming of various microcontrollers
In agreement with the customer we can perform various types of tests/inspections including those specific to the product with software and/or equipment provided by the customer.
Burn in
Burn-in is the process to which the components and/or the entire board are subjected before being put into service.
The intention is to identify those particular components that would fail as a result of so-called infant mortality, relative to the reliability of the same.
If the burn-in period is long enough, it can be reliably assumed that, once completed, the electronic board is almost completely free of further initial faults.
By applying burn-in, faults in the initial phase of use can be avoided, at the cost of a reduced useful life due to the time duration of the burn-in process itself.
For electronic components, burn-in is frequently conducted at high temperature and at times at high voltage.
Production certification with declaration of conformity of the product at the request of the customer
At the request of customers, we can produce a certification on the production carried out, often this is aimed at the declaration of the successful outcome of the inspection after assembly or even at a simple declaration that the product corresponds to the RoHS regulations.
We also work in the context of IPC 610 level 3
IPC is an international association that offers services related to the creation of processing standards in the world of applied electronics.
IPC is renowned worldwide for a series of programmes developed and approved in the industrial field that employ a “train the trainer” approach at two levels to ensure an understanding of the criteria addressed in the most widespread documents in the industrial sector.
This training produces industry recognised certifications to obtain and train highly skilled personnel.
The IPC-A-610 Rev.E certification, acceptability of electronic boards, is the standard most often employed and is used to identify the acceptance criteria of the final product and to determine high reliability in assembly and the connection processes performed on the boards produced.