Adequate verification at the various stages of production guarantees the quality of the product. The internal development of production test methodologies also guarantees the reduction of the same production cost because the tests are adapted to our production processes.
SMT (Surface Mount Technology) allows the mounting of electronic components on the printed circuit board without the need to drill holes and offers multiple advantages including:
Each phase of the SMT soldering process is monitored and validated through control instrumentation, by verifying the correct deposit of the solder paste, by AOI (Automatic Optical Inspection) that ensures the quality of the solder application and the correct positioning of the components. We also have X-RAY inspection machines for checking using images of the solder balls (this process is carried out on a sample or on 100% of production)
THT (through-hole or through-hole technology) is the technology in which the pins and rheophores of the components are inserted into the holes in the printed circuit board and soldered on the opposite side of the board, which EBV SRL implements as follows: