Traditional SMT soldering and with Vapour Phase technology, PTH with wave soldering with two reflow soldering ovens for the boards, forced air and Vapour Phase under vacuum
The forced (air) convection oven consists of 8 upper and 8 lower zones, programmable separately. The temperatures set in the various zones, in combination with the feed speed of the conveyor that carries the board into the process tunnel, produce a thermal movement called profile that must meet specific criteria. These criteria are dictated by the type of soldering alloy used and the components that make up the board in question.
In forced convection ovens, the heat exchange takes place through a gas (air or nitrogen) medium that, in meeting the object in question, transfers the necessary heat. The efficiency and therefore the ability to transfer the heat of a forced convection oven depends on several factors: the speed of the gas that envelops the board, the uniformity of the pressure on the surface of the board (caused by the moving gas) and the ability of the oven to keep the set temperatures constant when an external mass (the board) is introduced into the process tunnel.
The Vapour Phase machine is an ecological system based on the physical laws of heat transfer by vapour.This type of process almost automatically ensures the highest possible quality for product soldering.