SMT (Surface Mount Technology) allows the mounting of electronic components on the printed circuit board without the need to drill holes and offers multiple advantages including:
- Significant reduction in component sizes, resulting in smaller board sizes
- Maximum automation and speed of assembly procedures,
no waste due to the need to cut excess rheophores - The components can be mounted on both sides of
the printed circuit board and this does not exclude the possibility of
assembling boards employing both SMT and PTH technologies. - Each phase of the SMT soldering process is monitored and validated through control instrumentation, by verifying the correct deposit of the solder paste and by AOI (Automatic Optical Inspection) that ensures the quality of the solder application and the correct positioning of the components.
- We also have X-RAY inspection machines for checking via images of the solder balls (this process is carried out on a sample or on 100% of production)